If accuracy is paramount, the right imaging technology is crucial. We are thrilled to announce that Spectrum Logic will be attending the 13th Japan Inspection Instruments Manufacturers' Show (JIMA 2026) at Tokyo Big Sight from 16th-18th September.
Japan's premier event for industrial Non-Destructive Testing (NDT) and Automated X-ray Inspection (AXI), JIMA brings together leaders in technological innovation, with this year's offering our most advanced solution line-up.
Our team will be exhibiting and available to show how next-generation CMOS imaging can enhance your quality control process, whether you are seeking to tackle challenging non-destructive testing in harsh field environments or inspecting micro-level interconnects in advanced semiconductor chips.
Microcontroller - image courtesy of Neoscan
Booth J-18: Meet the Team.
At the Spectrum Logic booth J-18 Ed Bullard, Asmar Khan, Kirstie Mogilner and Tak Yamane will be available to answer your questions about our extensive selection of CMOS X-ray detectors.
All Spectrum Logic detectors use modern CMOS sensors with 14-bit or 16- bit digital outputs. Featuring dual-gain modes (High Dynamic and High Sensitivity), they are ideal for fast imaging at low doses. Our hardware utilizes Fiber Optic Plates (FOP) permanently fused to the sensors, ensuring enhanced image fidelity and radiation durability.
Next-Gen Detectors for NDT, AXI, and CT
Here is a preview of the high-performance detectors we will be highlighting on the exhibition floor:
1615HR — Precision for AXI & CT
Introducing our newest detector, engineered for fine-detail Automated X-ray Inspection and 3D Computed Tomography (CT), the 1615HR features a fine 50µm pixel pitch designed to deliver sharp, high-contrast imagery for critical failure analysis.
1615HR
Key Features
· 50 μm pixel pitch
· 55 frames per second – industry-leading speed
· 9M pixels – high resolution
· 160.5 × 150.15 mm active area – 25% larger than our best-selling 1412HR
2812HR-N — Built for Pipe & Weld Inspection
Purpose-built for demanding NDT field environments, the 2812HR-N is a dynamic detector tailored specifically for pipe weld inspection and microfocus CT.
2812HR-N
Key Features:
· Slimline profile engineered to fit inside 7” pipes
· IP65 waterproof rating
· 50 μm pixel pitch with high-res CsI or Gadox scintillator
· 29 fps full-resolution readout (with custom region-of-interest modes for even higher frame rates).
1510HS — Ultra-Slim, Ultra-Portable Imaging
At an industry-leading thickness of just 9mm, the 1510HS is designed to slip into cramped, hard-to-reach spaces—such as heat exchanger assemblies.
Image courtesy of Pexraytech. You can find out more about their PXR Micro 10 here.
Key Features:
· 100μm pixel pitch
· lightweight for field NDT (0.8kg)
· USB 3 single-cable operation (power, control, data transfer)
· Automatic Exposure Detection (AED) for easy, cable-free sync with portable sources
Be sure not to miss our Technical Presentation: introducing our 10μm 6060XR.
Save the date for Tak Yamane, our CMOS expert, who will be presenting about the latest detector designs.
Takahisa Yamane will present at JIMA 2026
Topic: Next generation, high-resolution, high-speed X-ray detectors for NDT: 1615HR, 1510HS, 2812HR-N, 6060XR
Time: 15:00 on Friday 18th September
Location: Room J1-14
Spotlight: Introducing the 6060XR (Extra Resolution)
During the session, Tak will introduce our revolutionary 6060XR—a 10µm pixel pitch CMOS detector purpose-built for real-time imaging and next-level 3D semiconductor packaging inspection.
Featuring a monolithic, stitched 60 × 60 mm² sensor and a ground-breaking ADC architecture, the 6060XR offers:
Ultra-low read noise (<10 e⁻): Outperforming traditional CMOS (~100 e⁻) and TFT detectors (>1,000 e⁻).
Extreme spatial resolution: Captures micro-structures without needing excessive geometric magnification, drastically cutting down image artifacts.
Compact, real-time operation: Perfect for high-speed, high-resolution CT scanners.
This level of resolution is a gamechanger for advanced semiconductor architectures—such as High-Bandwidth Memory (HBM) used in AI chips—where microscopic interconnections across stacked DRAM layers demand absolute imaging accuracy.
High bandwidth memory
"The 6060XR will be a unique detector designed specifically for high-resolution X-ray imaging of advanced semiconductor packaging. This innovation will help manufacturers control quality and yield in advanced packaging, including GPUs for AI applications and other cutting-edge semiconductor technologies."
— Ed Bullard, Chairman, Spectrum Logic
Plan Your Visit
We look forward to connecting with friends, partners, and industry peers in Tokyo!
Event: JIMA 2026 (13th Japan Inspection Instruments Manufacturers’ Show)
Venue: Tokyo Big Sight, Japan
Dates: September 18–20, 2026
Booth: J-18
Want to schedule a dedicated meeting with Ed, Asmar, or Tak during the event? Get in touch with us today to set up a time. See you in Tokyo! Contact us on inquiries@spectrumlogic.com.